SAN JOSE, Calif.--(BUSINESS WIRE)--Nov. 1, 2005--As a keynote speaker for the 3rd annual International System-on-Chip (SoC) Conference and Exhibition, Jon Kang, senior vice president of the Technical Marketing Group at Samsung Semiconductor, will provide a detailed analysis of how semiconductor memory is driving the Consumer Electronics (CE) market and what to expect for the next five years.

In a 40-minute presentation, "The Spark of the New Digital Revolution," beginning at 1:00 p.m., Tuesday, November 1, at the Radisson Hotel, Newport Beach (CA), Kang will discuss how advances in semiconductor technology and a mushrooming consumer appetite for high density mobile devices are dovetailing to usher in a new age -- the era of the pocket library.

From the vantage point of the largest investor in the advancement of the CE industry, Kang will examine why the migration to NAND Flash technology is continuing to skyrocket and why NAND Flash and other memory technology is becoming the single greatest catalyst in the CE market explosion. Kang will spotlight how custom pre-packaged logic and memory technologies are representing the wave of the future for data storage for mobile devices as they increase in functionality and further decrease in size.

"Samsung has played a pivotal role in enabling the creation of 3G smart phones, advanced PDAs, higher resolution digital cameras, the newest MP3 players and a new generation of portable gaming, with its low-power SoCs, and memory products such as NAND Flash memory, multi-chip packages, OneNAND(TM) and mobile DRAM," said Farhad Mafie, president and CEO of the Savant Company Inc and SoC Conference organizer. "We are very delighted to present a highly informative keynote speech by Mr. Jon Kang, Sr. Vice President of Technical Marketing at Samsung, at our 3rd International SoC Conference and Exhibit."

In addition, he will discuss the impact that NAND Flash and mobile SDRAM memories are having on the expanding CE market and how SoC design engineers can get ahead of the curve on shrinking CE devices that is resulting in increasing use of multi-chip memory packaging including stacked SoC-with-memory packages.

Savant's international System-on-Chip (SoC) conferences have emerged as one of the most important technical and informative venues for the chip design community. For more information about the 3rd SoC Conference & Exhibition, visit www.SoCconference.com .

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